Head suspension assembly and disk apparatus

ABSTRACT

A head suspension assembly includes a support plate, an interconnection member including a metal plate on the support plate, a first insulating layer on the metal plate, a conductive layer on the first insulating layer and forming a pair of connection pads, and a second insulating layer on the conductive layer, a head mounted in the interconnection member, and a piezoelectric element electrically connected to the connection pads and configured to displace the head when a predetermined voltage is applied to the connection pads. At least one opening is formed in each of the connection pads. The piezoelectric element is electrically connected to each of the connection pads by a conductive adhesive that is between the piezoelectric element and each of the connection pads and filled into the opening.

This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2019-025819, filed Feb. 15, 2019, the entire contents of which are incorporated herein by reference.

FIELD

Embodiments described herein relate generally to a head suspension assembly and a disk apparatus equipped with the same.

BACKGROUND

A disk apparatus, such as a hard disk drive (HDD), includes a plurality of magnetic disks rotatable within a casing, a plurality of magnetic heads each reading and writing information from and to one of the magnetic disks, and a head actuator supporting each magnetic head so that the magnetic head is movable with respect to the corresponding magnetic disk.

The head actuator has a plurality of head suspension assemblies each having a tip end portion that supports one magnetic head. Each head suspension assembly has a base plate having one end fixed to an arm, a load beam extending from the base plate, and a flexure or an interconnection member provided on the load beam and the base plate. The flexure has a displaceable gimbal portion and this gimbal portion supports the magnetic head.

In recent years, a head suspension assembly having a microactuator formed of a piezoelectric element has been proposed. The piezoelectric element is mounted in the flexure. Electrodes of the piezoelectric element are electrically and mechanically connected to a conductor pattern, for example, conductive pads on the flexure by, for example, a conductive adhesive.

DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded perspective view of a hard disk drive (HDD) according to an embodiment.

FIG. 2 is a plan view of a head suspension assembly of the HDD.

FIG. 3 is a perspective view depicting the head suspension assembly.

FIG. 4 is a plan view depicting an enlarged tip end portion of the head suspension assembly.

FIG. 5 is an exploded perspective view depicting pad portions and a piezoelectric element of a flexure in the head suspension assembly.

FIG. 6 is a plan view depicting the pad portions and the piezoelectric element of the flexure in the head suspension assembly.

FIG. 7 is a cross-sectional view of the pad portions and the piezoelectric element along line A-A of FIG. 6.

FIG. 8 is a plan view depicting pad portions and a piezoelectric element of an HDD according to a first modification.

FIG. 9 is a plan view depicting pad portions and a piezoelectric element of an HDD according to a second modification.

FIG. 10 is a plan view depicting pad portions and a piezoelectric element of an HDD according to a third modification.

FIG. 11 is a plan view depicting pad portions and a piezoelectric element of an HDD according to a fourth modification.

FIGS. 12 and 13 are each a cross-sectional view of pad portions and a piezoelectric element of an HDD according to a fifth modification.

DETAILED DESCRIPTION

In the HDD, a thermal stress generated when the HDD receives a heat from outside may cause a conduction failure between the conductive pads and the conductive adhesive of the flexure. In case of conduction failure, a function to electrically control the piezoelectric element is impaired. Thus, it is desirable to ensure a sufficient connection strength between each of the conductive pads and the piezoelectric element.

Embodiments provide a head suspension assembly and a disk apparatus that ensure a high connection strength between a conductive pad and a piezoelectric element and that improves reliability.

In general, according to one embodiment, a head suspension assembly includes a support plate, an interconnection member including a metal plate on the support plate, a first insulating layer on the metal plate, a conductive layer on the first insulating layer and forming a pair of connection pads, and a second insulating layer on the conductive layer, a head mounted in the interconnection member, and a piezoelectric element electrically connected to the connection pads and configured to displace the head when a predetermined voltage is applied to the connection pads. At least one opening is formed in each of the connection pads. The piezoelectric element is electrically connected to each of the connection pads by a conductive adhesive that is between the piezoelectric element and each of the connection pads and filled into the opening..

A disk apparatus according to an embodiment will be described hereinafter with reference to the drawings.

It is noted that the disclosure is presented by way of example only and matters which may be changed as appropriate without departing from the spirit of the disclosure and which could easily be conceived of by a person skilled in the art naturally fall within the scope of the present disclosure. Moreover, the drawings are often depicted schematically in magnitudes, shapes, and the like of parts, compared with actual forms for making clearer descriptions. However, the drawings are presented by way of example only and do not limit the reading of the present disclosure. Furthermore, in the present specification and the drawings, similar elements to those already described with reference to the drawings already used are denoted by the same reference signs and detailed descriptions thereof are often omitted as appropriate.

Embodiment

A hard disk drive (HDD) serving as a disk apparatus according to an embodiment will be described in detail.

FIG. 1 is an exploded perspective view of the HDD according to the embodiment with a cover detached. As depicted in FIG. 1, the HDD includes a rectangular casing 10. The casing 10 has a rectangular box-type base 12 having an opening upper surface and a top cover 14. The base 12 has a rectangular bottom wall 12 a and a side wall 12 b raised along the periphery of the bottom wall 12 a, and the bottom wall 12 a and the side wall 12 b are formed integrally from, for example, aluminum. The cover 14 is formed from, for example, stainless steel and formed into a rectangular plate shape. The cover 14 is screwed on the side wall 12 b of the base 12 by a plurality of screws 13 and seals the upper opening of the base 12.

The casing 10 includes a plurality of five magnetic disks 18, such as disk-like recording mediums, and a spindle motor 19 that supports and rotates the magnetic disks 18. The spindle motor 19 is disposed on the bottom wall 12 a. Each magnetic disk 18 is formed into a disk shape having a diameter of, for example, 95 mm (3.5 inches) and has a magnetic recording layer on each of or one of upper and lower surfaces thereof. The magnetic disk 18 is coaxially fitted into a hub, not depicted, of the spindle motor 19, clamped by a clamp spring 20, and fixed to the hub. The magnetic disk 18 is thereby supported in parallel to the bottom wall 12 a of the base 12. Each of the plurality of magnetic disks 18 are rotated at a predetermined revolving speed by the spindle motor 19.

While the five magnetic disks 18 are accommodated in the casing 18 in the present embodiment, the number of the magnetic disks 18 is not limited to five and may be increased or decreased. Alternatively, a single magnetic disk 18 may be accommodated in the casing 10.

The casing 10 includes a plurality of magnetic heads 17 each recording and reproducing information in and from one magnetic disk 18 (refer to FIG. 2) and a head actuator 22 supporting these magnetic heads 17 so that each magnetic head 17 is movable with respect to one magnetic disk 18. Furthermore, the casing 10 includes a voice coil motor (VCM) 24 that rotates and positions the head actuator 22, a ramp load mechanism 25 that holds any of the magnetic heads 17 at an unloaded position apart from the corresponding magnetic disk 18 when the magnetic head 17 moves to an outermost circumference of the magnetic disk 18, and a board unit 21 (e.g., a flexible printed circuit (FPC) unit) in which electronic components such as a conversion connector are mounted.

The head actuator 22 has an actuator block 29 incorporating a bearing unit 28, a plurality of arms 32 extending from the actuator block 29, and suspension assemblies 30 (often referred to as “head gimbal assemblies (HGAs)”) extending from the respective arms 32. One magnetic head 17 is supported on a tip end portion of each suspension assembly 30. The head actuator 22 is rotatably supported by a pivot raised on the bottom wall 12 a via the bearing unit 28.

A printed circuit board, not depicted, is screwed on an outer surface of the bottom wall 12 a. A control unit is implemented in the printed circuit board, and this control unit controls the spindle motor 19 to operate and also controls the VCM 24 and the magnetic heads 17 to operate via the board unit 21.

A configuration of the suspension assembly 30 will next be described in detail.

FIG. 2 is a plan view of the suspension assembly and FIG. 3 is a perspective view of the suspension assembly.

As depicted in FIGS. 2 and 3, each suspension assembly 30 has a suspension 34 extending from one arm 32, and one magnetic head 17 is attached to a tip end portion of this suspension 34. A combination of one magnetic head 17 and one suspension assembly 30 that supports this magnetic head 17 will be referred to as a “head suspension assembly”.

The suspension 34 that functions as a support plate has a rectangular base plate 42 formed from a metal plate at a thickness of several hundred micrometers, and a long and thin plate spring-like load beam 35 formed from a metal plate at a thickness of several tens of micrometers. The load beam 35 is disposed so that a base end portion thereof is superimposed on a tip end portion of the base plate 42 and fixed to the base plate 42 by welding a plurality of locations thereof. The base end portion of the load beam 35 has a width generally identical to that of the base plate 42. A rod-like tab 46 protrudes on a tip end of the load beam 35.

The base plate 42 has a circular opening 42 a provided in the base end portion and an annular projection portion 43 located around this opening 42 a. The base plate 42 is fastened to a tip end portion of the arm 32 by fitting the projection portion 43 into a circular caulking hole, not depicted, formed in a caulking bearing surface of the arm 32 and caulking this projection portion 43. A base end of the base plate 42 may be fixed to a tip end of the arm 32 by laser welding, spot welding, or adhesive bonding.

The suspension assembly 30 has a long and thin strip-like flexure 40 for transmitting recording and reproducing signals and a driving signal for driving a pair of piezoelectric elements (for example, PZT elements) 50 mounted in the flexure 40, and the piezoelectric elements 50. As depicted in FIG. 2, the flexure 40 has a tip end side portion 40 a that is disposed on the load beam 35 and the base plate 42, and has an extension portion 40 b that extends outward from a side edge of the base plate 42 and that extends along a side edge of the arm 32. A connection end portion 40C located on a tip end of the extension portion 40 b has a plurality of connection pads 40 f. These connection pads 40 f are connected to a main FPC of the board unit 21.

A tip end portion of the flexure 40 has a gimbal portion 36 that is located on a tip end portion of the load beam 35 and that functions as an elastic support portion. The magnetic head 17 is placed and fixed onto the gimbal portion 36 and is supported by the load beam 35 via this gimbal portion 36. The pair of piezoelectric elements 50 serving as driving elements are mounted in the gimbal portion 36 and are located closer to the base end of the load beam 35 than the magnetic head 17.

FIG. 4 is a plan view depicting the enlarged tip end portion of the suspension assembly 30.

As depicted in FIGS. 3 and 4, the flexure 40 has a sheet metal 44 a serving as a base and formed from stainless steel or the like, and a strip-like stacked member 41 bonded or fixed onto the sheet metal 44 a, and has a long and thin stacked plate. The stacked member 41 has a base insulating layer 44 b most of which is fixed to the sheet metal 44 a, a conductive layer 44 c that is formed on the base insulating layer 44 b and that makes up a plurality of signal interconnections 45 a, a plurality of driving interconnections 45 b, and the plurality of connection pads 40 f, and a cover insulating layer 44 d that covers the conductive layer 44 c to be stacked on the base insulating layer 44 b (refer to FIG. 7). As the conductive layer 44 c, a copper foil, for example, may be used. In the tip end side portion 40 a of the flexure 40, the sheet metal 44 a is bonded onto surfaces of the load beam 35 and the base plate 42 or welded thereonto at a plurality of welding points by spot welding.

In the gimbal portion 36 of the flexure 40, the sheet metal 44 a has a rectangular tongue portion 36 a that is located on a tip end side, a generally rectangular base end portion 36 b that is opposed to the tongue portion 36 a across a space and that is located on a base end side, a pair of long and thin outriggers 36 c that extend from the tongue portion 36 a to the base end portion 36 b, and a pair of handles 36 f that protrude from both side edges of the tongue portion 36 a to both sides thereof.

The base end portion 36 b is bonded onto the surface of the load beam 35 or fixed onto the surface of the load beam 35 by spot welding. The tongue portion 36 a has a size and a shape such that the magnetic head 17 is placed on the tongue portion 36 a, and has a generally rectangular shape, for example. The tongue portion 36 a is disposed so that a central axis in a width direction of the tongue portion 36 a matches a central axis C of the suspension 34. Furthermore, a generally central portion of the tongue portion 36 a abuts on a dimple 48 protruding in the tip end portion of the load beam 35. The tongue portion 36 a is displaceable in various directions by elastic deformations of the pair of outriggers 36 c. The tongue portion 36 a and the magnetic head 17 can thereby flexibly follow a surface fluctuation of the magnetic disk 18 in rolling and pitch directions and it is possible to maintain a minute gap between a surface of the magnetic disk 18 and the magnetic head 17.

In the gimbal portion 36, part of the stacked member 41 of the flexure 40 forks into two branches, which are located on both sides of the central axis C of the suspension 34. The stacked member 41 has a base end portion 47 a fixed to the base end portion 36 b of the sheet metal 44 a, a tip end portion 47 b bonded onto the tongue portion 36 a, a pair of strip-like first bridge portions 47 c extending from the base end portion 47 a to the tip end portion 47 b, and a pair of strip-like second bridge portions 47 d arranged side by side with the first bridge portions 47 c, extending from the base end portion 47 a halfway across the first bridge portions 47 c, and merging with the first bridge portions 47 c. The first bridge portions 47 c are located side by side with the outriggers 36 c on both sides of the tongue portion 36 a and extend along a longitudinal direction of the load beam 35. Furthermore, the first bridge portions 47 c extend to pass on the handles 36 f and crossbars of the outriggers 36 c and are partially fixed to the handles 36 f and the crossbars. Part of each first bridge portion 47 c has a mounting portion 60 in which each piezoelectric element 50 is mounted.

The magnetic head 17 is fixed to the tongue portion 36 a by an adhesive. The magnetic head 17 is disposed so that a longitudinal central axis thereof matches the central axis C of the suspension 34, and a generally central portion of the magnetic head 17 is located on the dimple 48. A recording element and a reproducing element of the magnetic head 17 are electrically joined to a plurality of electrode pads 40 d in the tip end portion 47 b by a conductive adhesive such as a solder or a silver paste. The magnetic head 17 is thereby connected to the signal interconnections 45 a via the electrode pads 40 d.

The mounting portion 60 and the piezoelectric element 50 will be described in detail.

FIG. 5 is an exploded perspective view depicting the mounting portion and the piezoelectric element of the flexure 40, FIG. 6 is a plan view of the mounting portion in which the piezoelectric element is mounted, and FIG. 7 is a cross-sectional view of the mounting portion and the piezoelectric element along line A-A of FIG. 6.

As depicted in FIG. 5, the mounting portion 60 has a first connection pad 70 a and a second connection pad 70 b each formed from the conductive layer 44 c. The first connection pad 70 a and the second connection pad 70 b are continuous with the driving interconnections 45 b each formed from the conductive layer 44 c. The first connection pad 70 a and the second connection pad 70 b are arranged side by side at a predetermined distance therebetween in a direction parallel to the center axis C of the load beam 35. In the present embodiment, the first bridge portions 47 c of the flexure 40 are divided between the first connection pad 70 aand the second connection pad 70 b. The first connection pad 70 a and the second connection pad 70 b are thereby disposed across a space at a predetermined length.

In the cover insulating layer 44 d stacked on the conductive layer 44 c, openings 72 a and 72 b are provided at positions overlapping the first connection pad 70 a and the second connection pad 70 b, respectively. Most of the first connection pad 70 a and most of the second connection pad 70 b are exposed to an outer surface of the cover insulating layer 44 d through the openings 72 a and 72 b, respectively. As an example, the first connection pad 70 a and the second connection pad 70 b are each formed into a rectangular shape, and the openings 72 a and 72 b are similarly each formed into a rectangular shape slightly smaller in dimensions than those of the first and second connection pads 70 a and 70 b.

According to the present embodiment, an opening 74 a is provided in part, for example, a generally central portion of the first connection pad 70 a. In the present embodiment, the opening of the connection pad is a through-hole that penetrates the connection pad in a thickness direction. The opening 74 a has, for example, a rectangular shape and penetrates the first connection pad 70 a. Part of the base insulating layer 44 b is exposed via the opening 74 a.

An opening 74 b is provided in part, for example, a central portion of the second connection pad 70 b. The opening 74 b has, for example, a rectangular shape and penetrates the second connection pad 70 b. Part of the base insulating layer 44 b is exposed via the opening 74 b. In the present embodiment, the second connection pad 70 b is used as a ground-side connection pad. In this case, the opening 74 b may further penetrate the base insulating layer 44 b. Part of the sheet metal 44 a is thereby exposed into the opening 74 b.

As an example, the piezoelectric element 50 serving as the driving element has a piezoelectric main body 50 a formed from a piezoelectric material and formed into a flat rectangular parallelepiped shape, and a first electrode 51 a and a second electrode 51 b provided on an outer surface of the piezoelectric main body 50 a. As the piezoelectric material, lead zirconate titanate or ceramic, for example, is used.

The first electrode 51 a extends from one end portion of a lower surface of the piezoelectric main body 50 a over a side surface of a short side and most of an upper surface of the piezoelectric main body 50 a. The second electrode 51 b extends from one end portion of the upper surface of the piezoelectric main body 50 a over a side surface of the other short side and most of the lower surface of the piezoelectric main body 50 a. On the lower surface of the piezoelectric main body 50 a, one end of the first electrode 51 a is opposed to one end of the second electrode 51 b at a gap given therebetween. On the upper surface of the piezoelectric main body 50 a, the other end of the first electrode 51 a is opposed to the other end of the second electrode 51 b at a gap given therebetween.

Applying a voltage between the first electrode 51 a and the second electrode 51 b causes the piezoelectric main body 50 a held between the first electrode 51 a and the second electrode 51 b to expand or contract in the longitudinal direction. As an example, the first electrode 51 a is a voltage application (Vin)-side electrode, while the second electrode 51 b is a ground (GND)-side electrode.

As depicted in FIGS. 5 to 7, the piezoelectric element 50 is disposed on the mounting portion 60 in a state in which one end portion of the piezoelectric main body 50 a in the longitudinal direction (i.e., the first electrode 51 a) is opposed to the first connection pad 70 a and in which the other end portion thereof in the longitudinal direction (i.e., the second electrode 51 b) is opposed to the second connection pad 70 b. A conductive adhesive Ad is filled between the first connection pad 70 a and the first electrode 51 a. As the conductive adhesive Ad, a solder or a silver paste, for example, may be used. The first electrode 51 a is electrically and mechanically connected to the first connection pad 70 a by the conductive adhesive Ad. At this time, the conductive adhesive Ad is also filled into the opening 74 a of the first connection pad 70 a, and adhesively bonded to a surface of the first connection pad 70 a, an inner surface of the opening 74 a, and the base insulating layer 44 b.

Likewise, the conductive adhesive Ad is filled between the second connection pad 70 b and the second electrode 51 b. The second electrode 51 b is electrically and mechanically connected to the second connection pad 70 b by the conductive adhesive Ad. The conductive adhesive Ad is also filled into the opening 74 b of the second connection pad 70 b, and adhesively bonded to a surface of the second connection pad 70 b, an inner surface of the opening 74 b, and the sheet metal 44 a.

A driving voltage is applied to the first electrode 51 a via the driving interconnections 45 b, the first connection pad 70 a, and the conductive adhesive Ad. While the second electrode 51 b is connected to the second connection pad 70 b via the conductive adhesive Ad and is also electrically connected to the sheet metal 44 a of the flexure 40, no problem occurs in a case of using the second electrode 51 b as a ground.

In the HDD configured as described above, applying the voltage to each piezoelectric element 50 via the driving interconnections 45 b causes the piezoelectric element 50 to expand and contract along the longitudinal direction of the piezoelectric element 50 (i.e., the direction parallel to the central axis C of the suspension 34). As indicated by an arrow D in FIG. 4, driving the two piezoelectric elements 50 in inverted directions of expansion and contraction causes the pair of first bridge portions 47 c to similarly stroke in opposite directions. The first bridge portions 47 c shake the tongue portion 36 a of the gimbal portion 36 and the magnetic head 17 in arrow D directions about the dimple 48 via the handles 36 f. In this way, it is possible to minutely displace the magnetic head 17 by expansion and contraction motions of the piezoelectric elements 50. The shaking directions D of the magnetic head 17 correspond to seek directions of the magnetic head 17 (i.e., cross-track directions) on the magnetic disk 18.

According to the present embodiment, the openings 74 a and 74 b are provided in at least one of the first connection pad 70 a and the second connection pad 70 b of the flexure 40, and provided herein in both of the first and second connection pads 70 a and 70 b. The conductive adhesive Ad filled between the electrodes 51 a and 51 b of each piezoelectric element 50 and the connection pads 70 a and 70 b is also filled into the openings 74 a and 74 b of the connection pads 70 a and 70 b and adhesively bonded to the surfaces of the connection pads 70 a and 70 b, the inner surfaces of the openings 74 a and 74 b, and the base insulating layer 44 b. This can enlarge a contact area between the adhesive Ad and each of the first and second connection pads 70 a and 70 b and improve an adhesive strength. Furthermore, filling the adhesive Ad into the openings 74 a and 74 b produces an anchor effect to further improve the adhesive strength. Moreover, since the opening 74 b penetrates the ground-side second connection pad 70 b and the base insulating layer 44 b in the ground-side second connection pad 70 b, the contact area between the inner surface of the opening 74 b and the adhesive Ad further increases and a greater anchor effect can be obtained. Therefore, the adhesive strength of the adhesive Ad to each of the first and second connection pads 70 a and 70 b is further improved.

Enhancing the adhesive strength between each of the first and second connection pads 70 a and 70 b and the conductive adhesive Ad in this way makes it possible to prevent occurrence of a conduction failure when the HDD receives a thermal stress from outside and to improve electrical connection reliability and operation reliability of the piezoelectric elements 50.

As described so far, according to the present embodiment, it is possible to provide the head suspension assembly and the disk apparatus that ensure a high connection strength of each piezoelectric element 50 and that improve the reliability.

The number of openings 74 a or 74 b in the first and second connection pads 70 a and 70 b is not limited to one and a plurality of openings may be provided in each of the first and second connection pads 70 a and 70 b. Furthermore, the shape of the openings 74 a or 74 b is not limited to the rectangular shape and may be selected from among various shapes. A plurality of modifications of the head suspension assembly will be described hereinafter. In the following modifications, same parts as those in the embodiment described above are denoted by the same reference signs and detailed descriptions thereof are either omitted or simplified.

(First Modification)

FIG. 8 is a plan view depicting connection pad portions and a piezoelectric element of a suspension assembly according to a first modification. As depicted in FIG. 8, according to the first modification, a plurality of, for example, three openings 74 a are formed in the first connection pad 70 a. The openings 74 a are each formed into a rectangular shape. Furthermore, two openings 74 b are provided in the second connection pad 70 b. In this way, providing the plurality of openings 74 a and 74 b makes it possible to increase the contact area between the conductive adhesive Ad and each of the first and second connection pads 70 a and 70 b and to increase the anchor effect. Therefore, the adhesive strength of the conductive adhesive Ad to each of the first and second connection pads 70 a and 70 b is further improved.

(Second Modification)

FIG. 9 is a plan view depicting connection pad portions and a piezoelectric element of a suspension assembly according to a second modification. As depicted in FIG. 9, according to the second modification, the opening 74 a of the first connection pad 70 a is formed into a comb-teeth shape. In other words, a plurality of openings 74 a are formed unevenly on a pair of opposed side edges of the first connection pad 70 a.

(Third Modification)

FIG. 10 is a plan view depicting connection pad portions and a piezoelectric element of a suspension assembly according to a third modification. As depicted in FIG. 10, according to the third modification, the opening 74 a of the first connection pad 70 a is formed into a wavelike shape.

(Fourth Modification)

FIG. 11 is a plan view depicting connection pad portions and a piezoelectric element of a suspension assembly according to a fourth modification. As depicted in FIG. 11, according to the fourth modification, two openings 74 a are formed in the first connection pad 70 a and each opening 74 a has a generally H-shape.

(Fifth Modification)

FIG. 12 is a cross-sectional view of connection pads and a piezoelectric element of an HDD according to a fifth modification. This cross-sectional view corresponds to the cross-sectional view shown in FIG. 7, i.e., along line A-A of FIG. 6. However, in the fifth modification, unlike the embodiments and modifications stated above, both connection pads 70 a and 70 b are arranged on one side of the piezoelectric element 50, and the other end of piezoelectric element 50 is simply bonded to the flexure 40 by the adhesive Ad. In other words, the connection pads 70 a and 70 b, the openings 72 a and 72 b, and the openings 74 a and 74 b, which are invisible in FIG. 12, are located on the left side of the piezoelectric element 50 (i.e., the side of the connection end portion 40C in FIG. 2).

FIG. 13 shows the two connection pads 70 a and 70 b viewed from the side of the connection end portion 40C. As shown in FIG. 13, similar to the other embodiments, the connection pads 70 a and 70 b are connected by the electrodes 51 a and 51 b of the piezoelectric element 50. However, unlike the embodiment shown in FIG. 6, there are no gaps in the sheet metal 44 a, the insulating layer 44 b, and the cover insulating layer 44 d between the two connection pads 70 a and 70 b. Further, insulating layers 44 e and 44 f are formed on the insulating layer 44 b between the openings 74 a and 74 b formed by the conductive layer 44 c, and there is a gap between the adhesives Ad of the two connection pads 70 a and 70 b. As such, no material is filled in the gap between the adhesives Ad. This configuration may be used when the piezoelectric element 50 is of a film type.

In any of the first to fifth modifications, it is possible to improve the adhesive strength between conductive adhesive Ad and each of the first and second connection pads 70 a and 70 b.

While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.

For example, while the pair of piezoelectric elements 50 are each configured to be attached to the gimbal portion 36 and located closer to the base end portion of the load beam 35 than the magnetic head 17 in the embodiment, the configuration of the pair of piezoelectric elements 50 is not limited to this configuration. The pair of piezoelectric elements 50 may be, for example, disposed on both sides in the width direction of the support portion (tongue portion 36 a) supporting the magnetic head 17 and arranged side by side with the magnetic head 17. The number of piezoelectric elements 50 is not limited to two and, for example, a single piezoelectric element may be used. The shape of the first and second connection pads 70 a and 70 b is not limited to the rectangular shape and may be selected from various shapes including an elliptical shape, a circular shape, a polygonal shape. 

1. A head suspension assembly comprising: a support plate; an interconnection member comprising a metal plate on the support plate, a first insulating layer on the metal plate, a conductive layer on the first insulating layer and forming a pair of connection pads, and a second insulating layer on the conductive layer; a head mounted in the interconnection member; and a piezoelectric element electrically connected to the connection pads and configured to displace the head when a predetermined voltage is applied to the connection pads, wherein at least one opening is formed in each of the connection pads, and the piezoelectric element is electrically connected to each of the connection pads by a conductive adhesive that is between the piezoelectric element and each of the connection pads and filled into the opening.
 2. The head suspension assembly according to claim 1, wherein the opening in each of the connection pads penetrates the conductive layer.
 3. The head suspension assembly according to claim 2, wherein the conductive adhesive is bonded to a surface of each of the connection pads, an inner surface of the opening, and a part of the first insulating layer.
 4. The head suspension assembly according to claim 1, wherein a plurality of openings is formed in each of the connection pads, and the conductive adhesive is between the piezoelectric element and each of the connection pads and filled into the plurality of openings.
 5. The head suspension assembly according to claim 4, wherein a total number of the openings in one of the paired connection pads is greater than a total number of the openings in the other of the paired connection pads.
 6. The head suspension assembly according to claim 1, wherein a plurality of openings is formed on both sides of at least one of the connection pads.
 7. The head suspension assembly according to claim 1, wherein the opening in at least one of the connection pads has a wavelike shape.
 8. The head suspension assembly according to claim 1, wherein the opening in at least one of the connection pads has an H-shape.
 9. The head suspension assembly according to claim 1, wherein the pair of connection pads are arranged on one side of the piezoelectric element.
 10. The head suspension assembly according to claim 1, wherein the opening in at least one of the connection pads penetrates the conductive layer and the first insulating layer, and the conductive adhesive is bonded to the surface of the one of the connection pads, an inner surface of the opening, and a part of the metal plate.
 11. A disk apparatus comprising: a disk-like recording medium having a recording layer; and a head suspension assembly comprising: a support plate, an interconnection member disposed on the support plate and comprising: a metal plate on the support plate, a first insulating layer on the metal plate, a conductive layer on the first insulating layer and forming a pair of connection pads, and a second insulating layer on the conductive layer, a head mounted in the interconnection member and configured to read data from and write data onto the recording layer, and a piezoelectric element electrically connected to the connection pads and configured to displace the head when a predetermined voltage is applied to the connection pads, wherein at least one opening is formed in each of the connection pads, and the piezoelectric element is electrically connected to each of the connection pads by a conductive adhesive that is between the piezoelectric element and each of the connection pads and filled into the opening.
 12. The disk apparatus according to claim 11, wherein the opening in each of the connection pads penetrates the conductive layer.
 13. The disk apparatus according to claim 12, wherein the conductive adhesive is bonded to a surface of each of the connection pads, an inner surface of the opening, and a part of the first insulating layer.
 14. The disk apparatus according to claim 11, wherein a plurality of openings is formed in each of the connection pads, and the conductive adhesive is between the piezoelectric element and each of the connection pads and filled into the plurality of openings.
 15. The disk apparatus according to claim 14, wherein a total number of the openings in one of the paired connection pads is greater than a total number of the openings in the other of the paired connection pads.
 16. The disk apparatus according to claim 11, wherein a plurality of openings is formed on both sides of at least one of the connection pads.
 17. The disk apparatus according to claim 11, wherein the opening in at least one of the connection pads has a wavelike shape.
 18. The disk apparatus according to claim 11, wherein the opening in at least one of the connection pads has an H-shape.
 19. The disk apparatus according to claim 11, wherein the pair of connection pads are arranged on one side of the piezoelectric element.
 20. The disk apparatus according to claim 11, wherein the opening in at least one of the connection pads penetrates the conductive layer and the first insulating layer, and the conductive adhesive is bonded to the surface of the one of the connection pads, an inner surface of the opening, and a part of the metal plate. 